SEMI - Columbia Seligman Semiconductor & Technology ETF
News Charts Conversations Range : 1d 5d 6m 1y Max 28.37+0.47 (+1.68%)at Mon, Jun 17, 2024, 2:07PM EDT - U.S. markets open in 3 hours 35 minutesDelayed Quote Ask Price 42.52 Bid Price 0.00 P/E N/A 52 Wk. High 28.43 52 Wk. Low 17.24 Mkt. Cap N/A window.setTimeout(function() {ls = document.getElementById("libra-SEMI-1d");yfinanceLibra.init( {symbol: "SEMI",range: "1d",h: 103,locale: "en-US",ui: { canvasBgColor: '#fff',watermark: false,graphLineWidth: 1,graphLineColor: '#0081F2',graphAreaColor: 'rgba(196, 238,245, 0.50)'}},ls,function(err) { if(err && console === Object(console)) { console.error(err); } });}, 1);window.setTimeout(function() {ls = document.getElementById("libra-SEMI-5d");yfinanceLibra.init( {symbol: "SEMI",range: "5d",h: 103,locale: "en-US",ui: { canvasBgColor: '#fff',watermark: false,graphLineWidth: 1,graphLineColor: '#0081F2',graphAreaColor: 'rgba(196, 238,245, 0.50)'}},ls,function(err) { if(err && console === Object(console)) { console.error(err); } });ls = document.getElementById("libra-SEMI-6mo");yfinanceLibra.init( {symbol: "SEMI",range: "6mo",h: 103,locale: "en-US",ui: { canvasBgColor: '#fff',watermark: false,graphLineWidth: 1,graphLineColor: '#0081F2',graphAreaColor: 'rgba(196, 238,245, 0.50)'}},ls,function(err) { if(err && console === Object(console)) { console.error(err); } });ls = document.getElementById("libra-SEMI-1y");yfinanceLibra.init( {symbol: "SEMI",range: "1y",h: 103,locale: "en-US",ui: { canvasBgColor: '#fff',watermark: false,graphLineWidth: 1,graphLineColor: '#0081F2',graphAreaColor: 'rgba(196, 238,245, 0.50)'}},ls,function(err) { if(err && console === Object(console)) { console.error(err); } });ls = document.getElementById("libra-SEMI-max");yfinanceLibra.init( {symbol: "SEMI",range: "max",h: 103,locale: "en-US",ui: { canvasBgColor: '#fff',watermark: false,graphLineWidth: 1,graphLineColor: '#0081F2',graphAreaColor: 'rgba(196, 238,245, 0.50)'}},ls,function(err) { if(err && console === Object(console)) { console.error(err); } });}, 1000);NYSEArca•Price in USD
Instant Noodel Packaging Machine | Noodles Packing Machinery ...
Noodles Packaging Machine. We make customized packaging styles for instant noodles, according to packing way request, also consider workshop size, noodle cakes features. SHANG BAO TAI make the noodles with different package, bag/pillow, cup/barrel, bowl are alternative.
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Our noodle packing machine is an ideal choice for instant noodles, bag noodles, etc. Its pillow pack can perfectly seal the noodle from damp. Need more instant noodle packing machines? Just contact Tai Dragon now!
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Soontrue is a professional pillow packing machine manufacturer, focusing on pillow bag packaging machines over years. We offer vertical a wide range of vertical packaging machine and horizontal wrapping machine to fit any business needs.
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Product Detail. main feature: Large pillow packing machine. Watch on. * Man-machine interface, PLC program. * Driven by three servo motors, no products and no packaging. * Photoelectric sensor, automatically and accurately track the cutting position. * Safety protection measures meet the EU CE certificate.
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α8 Series. Features. FUJI MACHINERY presents a new flagship model of high speed horizontal pillow packaging machine. We brushed up the basic characteristics of packaging machines and produced a safe and secure machine that is easier to understand and use than previous models.
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Pillow Bag Automatic Fresh Noodle Noodles Packing Packaging ...
Pillow Bag Automatic Fresh Noodle Noodles Packing Packaging Machine. Reference FOB Price. Get Latest Price. US $35,000.00-38,000.00 / Set |. 1 Set (Min. Order) Contact Supplier. Contact Now. Inquiry Basket. Anhui Koyo packaging Machinery Diamond Member Since 2018. Audited Supplier. Manufacturer/Factory. Product Description. Company Info.
Instant Noodle Packing Machine For Pillow Type
Pillow type packaging machine is a kind of continuous packaging machine with strong capacity, and can be suitable for a variety of specifications for food and non food packaging. It not only can be used for the packaging of non - brand packaging materials, but also can use the logo design of the drum material for high-speed packaging.
